Conference Information

 GENERAL INFORMATION

       Happy and pleased to note the success and the echo of the previous editions of the International Conference “Materials for Electrical Engineering”, MmdE (since 1997) and of the IEEE Romanian Magnetic Society Chapter Conference, IEEE-ROMSC (since 2004) and wishing that they become a solid tradition, the Electrical Engineering Faculty of the “Politehnica” University of Bucharest, the Faculty of Physics of the “Alexandru Ioan Cuza” University in Iasi and the Institute of Advanced Research in Electrical Engineering (ICPE-CA) of Bucharest with the collaboration of Romanian Society for Magnetic Materials (SRMM) will organize the second Joint International Conference, bringing together the 6th Conference MmdE and the 5th Conference IEEE-ROMSC

The MmdE & ROMSC 2008 Conference will be focused on modelling, advanced characterization and applications of magnetic and dielectrics materials.


 CONFERENCE LOCATION

The Conference will be held in Bucharest, Romania at the University Politehnica of Bucharest. Bucharest is the greatest city and capital of Romania and has much to offer to visitors. You can visit many museums, go shopping downtown, or take a leisurely walk across many beautiful sites in the city while you are also enjoying the company of scientists and engineers from many countries.

Visit the links section for more information on the hotels and Bucharest culture, history and atractions.

You can download from here an orientative map to guide you from the Otopeni Aeroport to University Politehnica of Bucharest.


 CONFERENCE STRUCTURE

The Conference will consist in parallel sessions of oral and poster presentations. There will be plenary and invited speakers in both main topics of the meeting, concerning magnetic and dielectric materials, respectively.

The program will be complemented by other series of activities.


For registration, please fill the form in Conference Registration tab and send it via e-mail to mmde2008@elmat.pub.ro


 PAPER INFORMATION

Check the Call of Papers tab for the latest information.


 CONFERENCE FEES

The fees are presented in the table below. It includes the participation in the Conference, Conference Proceedings, Welcome Cocktail, Conference Banquet, Lunches and Refreshments.

Conference fees Member IEEE Non-member IEEE Student
100 euro 120 euro 70 euro

Participants can pay the fee by bank transfer at The Romanian Society of Magnetic Materials (SRMM - fiscal code: 4569204), accounts opened at
Comercial Bank of Romania (BCR), Lipscani Filial, Bucharest:

For Romanian Lei (RON) 2511.A01.0.50878.0090.ROL.1 - IBAN code RO29 RNCB 0090 0005 0878 0001

For Euros (EUR) 2511.A01.0.50878.0090.EUR.2 - IBAN code RO02 RNCB 0090 0005 0878 0002

For US Dollars (USD) 2511.A01.0.50878.0090.USD.3 - IBAN code RO72 RNCB 0090 0005 0878 0003

Swift Code: RNCB ROBU

The participants can also pay at registration.




 ORGANIZING COMMITTEE

            Horia GAVRILA

            Petru V. NOTINGHER

            Alexandru STANCU

            Wilhelm KAPPEL


            Valentin IONITA

            Florin CIUPRINA

            Laurentiu STOLERIU


            Mirela Maria CODESCU

            Adela BARA

            Eugen MANTA


            Lucian PETRESCU

            George EPUREANU

            Laurentiu DUMITRAN




 INTERNATIONAL SCIENTIFIC COMMITTEE

Petru ANDREI, Florida State Univ., USA

Pierre ATEN, LEMD-CNRS/UJF, Grenoble, France

Emil BURZO, Univ. Babes-Bolyai, Cluj-Napoca, Romania

Ovidiu CALTUN, Univ. A.I.Cuza, Iasi, Romania

Alfred CAMPUS, Borealis Polymers NV, Belgium

Ching-Ray CHANG, National Univ. of Taiwan

Roy W. CHANTRELL, York Univ. UK & Seagate Pittsburg, USA

Irinel CHIORESCU, Florida State Univ., USA

Horia CHIRIAC, INCD Fizica Tehnica, Iasi, Romania

Florin CIUPRINA, Univ. Politehnica of Bucharest, Romania

Lucien DASCALESCU, Univ. de Poitiers, France

Edward DELLA TORRE, Univ. George Washington, USA

André DENAT, CNRS, Grenoble, France

Oksana FESENKO CHUBYYKALO, Instituto de Cienca de Materials, Madrid, Spain

Jean-César FILIPPINI, CNRS, Grenoble, France

Fausto FIORILLO, Ist. Electrotehnico Nazionale, Torino, Italia

Masaaki FUTAMOTO, Hitachi Central Research Laboratory, Tokyo, Japan

Doina GAVRILA, Univ. Politehnica of Bucharest, Romania

Horia GAVRILA, Univ. Politehnica of Bucharest, Romania

Vincent G. HARRIS, Northeastern Univ., USA

Evgenyi IL’YASHENKO, Moscow Univ., Russia

Valentin IONITA, Univ. Politehnica of Bucharest, Romania

David JILES, Cardiff Univ., UK

Wilhelm KAPPEL, ICPE-CA, Bucharest, Romania

Afef LEBOUC, Inst. Nat. Polytehnique, Grenoble, France

Olivier LESAINT, LEMD-CNRS/UJF, Grenoble, France

Pedro LLOVERA SEGOVIA, ITE Valencia, Spain

Liliana MITOSERIU, Univ. A.I.Cuza, Iasi, Romania

Petru V. NOTINGHER, Univ. Politehnica of Bucharest, Romania

Petru P. NOTINGHER, Univ. Montpellier II, France

Kevin O’GRADY, York Univ, UK

Gerard PLATBROOD, LABORELEC, Belgium

Mihai POPESCU, INFIM Bucharest-Magurele, Romania

Roy ROSHKO, Univ. of Manitoba, Canada

Leonard SPINU, Univ. of New Orleans, USA

Alexandru STANCU, Univ. A.I.Cuza, Iasi, Romania

Gilbert TEYSSEIDRE, INSE, Toulouse, France

Alain TOUREILLE, Univ. Montpellier II, France

François VARRET, Univ. de Versaille, France

Juan Martinez VEGA, INSA, Toulouse, France

Detlef WALD, Borealis Polimers NV, Belgium

Michael WERTHEIMER, Ec. Polytechnique, Montréal, Canada

Arthur YELON, Ec. Polytehnique de Montreal, Canada

Jean - Paul YONNET, Inst. Nat. Polytehnique, Grenoble, France